The processes are combinations of mechanical, chemical, thermal and inspection steps.

Based on techniques used in the semiconductor industry, where wafer reclaim is highly developped and incoming wafers are showing a high variability, our process is permanently adapted to the incoming material.

Depending on the type and level of impurities, found on each piece, the combination of processing steps is adapted so as to ensure contamination removal with a minimum silicon losses. 

Correlatively, this also ensures a maximum efficiency of the line.

Due to the extreme variability of the incoming material , from batch to batch and from technology to technology, several processes have already been developped and new steps are evaluated permanently, in addition and/or replacement of the existing ones. 

Each change or set of changes bringing significant process improvment is submitted to our clients, evaluation samples are provided and tested before the new process can be applied in production. 

Incoming Material >